Altaflex, a division of OSI Electronics
New Interconnect Solutions using Printed Elecronics
Printed electronics has a rich in history in consumer products; however, its limitations has generally relegated the technology to fairly simple designs and products. The emergence of high density conductive paste offers customers the opportunity to develop interconnect solutions to create the next generation of products. Altaflex can sinter silver on a high performance dielectric like polyimide or novel materials such as polyester or paper.

As the printed electronics marketplace begins to mature, Altaflex can enable customers to realize new interconnect solutions by offering process proficiency at the development level which can be deployed globally.
Summarized Process Capabilities
			  High Density	Standard
Maximum Silver Paste Printing Area	150 x 150 mm (5.9 x 5.9 in)	250 x 250 mm (9.8 x 9.8 in)
Silver Paste Line/Space on Soft Material	50 um/50 um	100 um/100 um
Silver Paste Line/Space on Hard Material	35 um/35 um	75 um/75 um
Silver Paste Thickness	10-13 um	10-13 um
Silver Paste	0.05 Ω/• (Thickness: 10 um)	0.05 Ω/• (Thickness: 10 um)
Trace to Edge Distance	150 um	300 um
Layer to Layer Registration	75 um	150 um
Embedded Resistors	Yes	Yes
SMT Component Assembly	Yes	Yes
Silver Paste on Flex and Rigid-flex Circuits	Yes	Yes