Printed electronics has a rich in history in consumer products; however, its limitations has generally relegated the technology to fairly simple designs and products. The emergence of high density conductive paste offers customers the opportunity to develop interconnect solutions to create the next generation of products. Altaflex can sinter silver on a high performance dielectric like polyimide or novel materials such as polyester or paper.

As the printed electronics marketplace begins to mature, Altaflex can enable customers to realize new interconnect solutions by offering process proficiency at the development level which can be deployed globally.