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Material Selection and Fabrication
Capabilities
Material selection, process tolerances, design for
manufacturing, and
your flex supplier all play an important role in producing a
cost-effective and reliable flex circuit design. Altaflex will
assist you in design for manufacturing to minimize overall program
costs. Listed are standard materials and capabilities.
Come speak with us about your application requirements.
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Base
Materials |
Polyimide,
Polyester, LCP (liquid crystal polymer), PEN (polyethylene
napthalate) |
|
Polyimide
Thickness |
0.0005" (12 um),
0.001" (25 um), 0.002" (50 um), 0.003" (75 um), 0.005" (125
um) |
|
Copper Thickness |
0.125 oz. (5 um), 0.25 oz. (9 um), 0.33 oz. (12 um), 0.5 oz. (17 um), 1 oz. (35
um), 2 oz. (70 um) |
|
Cover Layer |
Polyimide, Polyester,
LPI (liquid photo imageable), Shielding Film |
|
Stiffeners |
FR-4, Polyimide,
Metal, Alloy, or Customer Supplied |
|
Thermal Set
Adhesives |
Acrylic, Phenolic
Butyral, Modified Epoxy, Conductive |
|
Surface
Finishes |
Hot Air Solder
Leveling (tin/lead & lead free), Electrolytic Soft Bondable
and Hard Gold, ENIG (electroless
nickel immersion gold), Entek 106A, Immersion Silver or Tin | |
| |
High Density |
Standard |
Minimum Trace/Space (subtractive etch)
|
0.001"/0.0015" (0.25 oz.)
0.0015"/0.002" (0.33 oz.)
0.002"/0.0025" (0.5 oz.)
0.003"/0.0035" (1 oz.) |
0.0015"/0.002" (0.25 oz.) 0.002"/0.0025" (0.33 oz.)
0.0025"/0.003" (0.5 oz.)
0.0035"/0.004" (1 oz.) |
Minimum Via Hole Diameter (before
plating)
|
0.006" (NC Drill)
0.002" (UV
Laser) |
0.008" (NC Drill)
0.004" (UV
Laser) |
|
Minimum Blind Via Diameter (before plating) |
0.004" (UV Laser) |
0.008" (UV Laser) |
Trace to Edge Distance
|
0.001" (UV Laser) |
0.008" (NC Route) 0.005" (Die
Punch) 0.003" (UV Laser) |
Trace to Edge Tolerance
|
0.0005" (UV Laser) |
0.005" (NC Route)
0.003" (Die
Punch)
0.001" (UV Laser) |
|
Cover Layer Aperture Positional Tolerance |
0.001" (Laser Defined) |
0.003" (Cover
Film)
0.002" (LPI) | |
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