Altaflex continues to invest in technology to support new and existing customers with global interconnect solutions. Our goal is to empower customers by providing a toolbox of technologies and capabilities to help develop tomorrow’s products.
10 μm feature size
UV Yag Laser systems
20 μm beam width for high accuracy
High-speed NC drill
Automated Optical Inspection down to 8 μm feature size
X-Ray inspection for via alignment and solder paste
X-Ray Fluorescence measurement of surface finish thicknesses
Provides fully customizable serialization and date coding
Flying probe electrical tester
Micro needle probes for minimal witness mark
Smallest pad size: 35 μm, 100 μm pitch.
Impedance testing at 20GHz
short-trace measurements down to 0.75 inches